Details about INSAT RMA LIQUID SUPER FLUX 50ml - NO CLEAN ROL0INSAT RMA LIQUID SUPER FLUX 50ml - NO CLEAN ROL0 See original listing
09 Jan, 2012 19:10:40 GMT
London, London, United Kingdom
New: A brand-new, unused, unopened and undamaged item in original retail packaging (where packaging is ... Read moreabout the condition
Insat Liquid Super Flux 50mL
Clear amber liquid
Here is a comment from a satisfied customer.
"thats fine jimmy. if you want to mention the company name then thats also fine. i have no issues with people knowing what ive said as i stand by the fact that this is the best flux ive ever used."
UK Console Repairs
sorry to keep emailing i bet your sick of me. just done another reflow of a vigin 0110 error code and yet again its booting. im 14/14 for reflows on virgin boards with your flux. ive never had a success rate like that before which shows 100% that its the flux as its the only thing ive changed.
just thought id let you know.
UK Console Repairs
A very satisfied customer has sent me this link with the message saying he had the cleanest ever chip lift using our flux
I agree its amazing flux, we love it in here :). I will definitely be ordering our flux from you in future.
Thanks for being honest :)
Hi - I\'m a moderator over at T-X and wonder if you\'re still offering
Our liquid flux is a unique product intended for reflowing and reworking unlike those that are primarily intended for wave soldering which are unsuitable to be used with reflow profiles.BGA failures could be due to:
In wave soldering the flux is either sprayed or foamed and applied to the PCB and the total exposure time to soldering temperatures is around 10 seconds.
When you reflow a games console or a notebook the time-temperature profile is typically 4 1/2 minutes. A flux designed for wave soldering is really meant for conveyor belt soldering of PCBs and not reworking or reflowing PCBs.
Most liquid fluxes would simply evaporate away during the running of a reflow profile, possibly allowing the solder joints to be re-oxidated which would result in early failure due to having low solids content. (around 4% by wt)
Our flux has a carefully chosen amount to maximise its functions. Mildly active acids in the flux remove the oxides from the metal surfaces to be soldered. The solids in the flux are responsible for creating an oxygen barrier to prevent the metal surfaces becoming re-oxidate at near soldering temperatures. Our flux is designed to provide not only an oxygen barrier but also a moisture barrier over the soldered areas, not forgetting prevention of solder bridging in fine pitch devices like BGAs.
Our flux is the only liquid flux that addresses all the issues that cause early failure of reflowed games consoles and notebooks or whatever else.
We are confident that if any flux could single handedly solve the problem of reflowing, than this is the one. This is a brave statement to make, but that is how excited we are about this flux. We could run tests for the next couple of years to prove our point but feel confident if this doesn't work, then nothing will and give up on the idea of reflowing and instead just reball or replace the BGA with a new one.
This is a test for reflowing. Most console repair shops have given up on the idea of reflowing due to high numbers of failure in a matter of weeks or a few months at best.
As they say in the rework industry, a flux can be your best friend or your worst enemy. We think our flux will be your best friend.
RMA - Rosin Mildly Activated ROL0
Meets IPC-SF-818 Standard for the lowest flux residue corrosivity and highest surface resistance category.
Maximum RMA activity to remove metal oxides completely, and quickly.
Completely non-corrosive and non-conductive. Our flux starts to activate from about 85 deg C and has a wide temperature window to well above 260 deg C to see through the profile reflowing process to the end with no risk of re-oxidation. No corrosivity or conductivity issues due to being a no-clean flux.
Some people may find it too tacky but that is a small price to pay since the natural rosin is a very tacky substance but unlike synthetic resins, it stands up to high temperatures and in our opinion the best choice for reliable fluxing. Flux residue just wipes off with isopropyl alcohol or other solvents easier than any other flux we have used.
We recommend the following times and temperatures for your reflow process for all lead-free equipment.
1. Preheat the PCB using the bottom heater of your rework machine from room temperature (25 deg C) to 150 deg C in about 2 minutes. The rate of temperature rise should not exceed 2 deg per second in our view.
2. Soak the PCB for 90 seconds and allow the PCB temperature to rise to 185 deg C at the end of this time. This means that the rate of temperature rise is slowed right down to allow the flux to remove the oxides and even out the PCB temperature, readying it for the reflow process. Use the bottom heater to raise the PCB temperature as much as possible which will reduce the amount of heat applied to the BGA directly, therefore minimising heat related damage to the BGA itself. If the final soak temperature of 185 deg C cannot be reached in the allocated time, then use the top heater as well to assist the bottom heater.
3. Reflowing stage demands that the temperature of the PCB is raised to well over 217 deg C (melting point of lead-free solder) and we suggest 235 deg C as the maximum reflow temperature. The temperature ramp rate should be increased so that the maximum can be reached in 30-45 seconds after the end of the soak stage. Allow a few seconds at the maximum reflow temperature and then switch the top and bottom heaters off.
4. Allow the PCB to cool back to room temperature.
If you reflow leaded solder equipment then you may use 205 deg C or 220 deg C as your maximum reflow temperatures. Please note that the actual temperature under the BGA may be higher by 10 to 20 deg C than what is being measured by your thermocouple or IR thermometer. Accordingly you may use slightly lesser maximum reflow temperatures just in case.
When reflowing PS3 or XBox360, it is important to use anti-warp jigs as both items suffer from PCB warping when heated.
Flux must be applied in sufficient quantity for thorough oxide removal and to avoid both metal re-oxidation and flux exhaustion or evaporation prior to solder wetting.
Our flux is manufactured for us by a top US flux manufacturer.
I sent some of this flux to Karl at UK Console Repairs to test it out. I am pasting some of his emails with his permission:
thats fine jimmy. if you want to mention the company name then thats also fine. i have no issues with people knowing what ive said as i stand by the fact that this is the best flux ive ever used.
UK Console Repairs
ok jimmy got some more feedback for you.
ive been having a debate with some people on my forum who claim that flux makes no difference to the outcome of a reflow as “flux is flux”. i told them they were wrong and that tbh they shouldnt argue with someone who knows what i know and they still didnt believe me.
anyway, i decided to test your flux on an 0102 that had a failed reflow attempt by myself using kester 979. i did this purely to test my theory as the GPU was ohming good across C5D5 so i knew it was an issue that didnt require a reball. so i reflowed this xbox and its just finished its cooling cycle on the achi. i have just bench tested the board and would you know green lights and booting straight to kinect dashboard.
i think that is point proven and i will be honest and say ive been converted, i really had no faith in reflows until now so thank you.
i have put a link to this flux and recommended it on my repair thread on team xecuter forum and will also be creating a back link on my website recommending you for all supplies.
thanks and sorry to talk your ear off.
UK Console Repairs
ive noticed when using this for chip lift it drastically reduces the melt temp of lead free solder so im able to lift xenons at around 205C which as you know with xenon GPU’s is a good thing as they dont withstand heat too well so im really impressed. got a few more reflows to do today with it but some have been tampered with but ill let you know how i get on.
UK Console Repairs
no probs i enjoy testing it and so far am 100% successful on virgin boards. if i had anything negative to say believe me i would tell you but i honestly cant find anything. ive been watching closely to see the flux working its magic at different stages of the reflow and early on you can see it warming up and it bubbles a little bit around the bga. this then stops at about 140C and you can then see it effecting the solder spheres as if it was cleaning them and the spread during heating is perfect. at around 205C all solder spheres turn bright silver within a few seconds of each other which indicates the reaction time across the bga is perfect. ive also found there is very little smoke produced, a lot of fluxes produce heaps of smoke but this stuff seems to go about its business in a way that you would barely notice apart from a slight smell which isnt even a horrible smell, unlike some of the cheap ebay flux that gives me headaches and makes me feel ill after an hour or so of use. it does leave residue around the bga but its the easiest residue to clean that ive ever come across and once cleaned it doesnt stain like some of the cheap flux does.
i would totally agree that this flux is a winner and im very happy ive had the chance to test it for you as its really changed my perspective on reflowing bgas as oppose to reballing. of course there are just some consoles that even this flux cant reflow but thats not due to the flux its purely because theyve been badly treated in the past and “reflowed” at 500C with a paint stripper and the board is either warped or the bga popcorned or worse still like i had the other day, on lift the pads are missing but theyd been heatgunned really badly.
ive started using it for my lifts now when reballing and the solder cleans up really easily off both the board and the bga when the chip has been lifted using this flux.
UK Console Repairs
Today (18.8.2011), I had to reflow my Dell XPS M1710 GPU. Used the Insat Super RMA liquid flux of course, and used the same profile as I do with all lead-free equipment. It worked perfectly. I have stuck an sticker underneath the XPS and will be keeping a log as to its behaviour. I used a very cheap thermal paste (white creamy stuff) from CPC to run the GPU as inefficiently as possible. No fancy high price thermal paste.
It has never run as cool as it is after the reflow. Usually I have it on my lap and it gets pretty hot. I can only tolerate it for 10 - 15 minutes before I put it on the table. Now it doesn't appear to be as uncomfortable. I am really impressed myself.
Just received a call from Tony (a customer and a friend), who bought some XBox360 GPUs from me and reballing flux (LF-4300-TF) as well as the Insat Super Liquid flux. He told me that after soldering in the XBox360 GPU it failed to work. He was certain that the GPU had been soldered in properly and did not feel it necessary to remove and reball. Instead, he decided to use the Insat Super Liquid Flux and guess what, it fired up and worked perfectly. I told him that for reflowing or soldering in, I'd not recommend the LF-4300-TF and instead use it exlusively for reballing as it has has tackiness and keeps the solder balls on the pads better than any other flux I know.
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