Reflow Soldering Processes SMT BGA CSP and Flip Chip Technologies Ning-Cheng Lee

Condition: Like New

£59.99

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About this item

Condition
Like New
Seller notes
Like new. Never read. Unwanted gift.
Quantity
1 available
Format
Paperback
Subjects
Electronics
Subject 2
Technology
Author
Ning-Cheng Lee

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