Microelectronics Packaging Handbook: Subsystem Packaging Part III (Pt. 1)

Condition: New

£150.94

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About this item

Condition
New
Quantity
1 available
Format
Hardback
Country of Origin
USA, United States
Dimensions (LxWxH) - Cms
9.21x1.5x6.14
Manufacturer/Packer/Importer Details
ERGODE
ISBN-10
0412084511

Item description