Area Array Packaging Handbook: Manufacturing and Assembly

Condition: New

£48.14

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About this item

Condition
New
Quantity
1 available
Format
Hardback
Country of Origin
USA, United States
Publisher
McGraw-Hill
Manufacturer/Packer/Importer Details
ERGODE
Dimensions (LxWxH) - Cms
7.6X2.33X9.3

Item description

"*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)"
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