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About this product
- DescriptionBias Temperature Instability for Devices and Circuits
- PublisherSpringer-Verlag New York Inc.
- Date of Publication23/10/2013
- GenreElectronics Engineering & Communications Engineering
- Place of PublicationNew York, NY
- Country of PublicationUnited States
- ImprintSpringer-Verlag New York Inc.
- Content Note283 black & white illustrations, 318 colour illustrations, 22 black & white tables, biography
- Weight1526 g
- Width155 mm
- Height235 mm
- Spine41 mm
- Edited byTibor Grasser
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Thanks, we'll look into this.