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About this product
- DescriptionBeginning with an overview of electronic packaging, this insightful book discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).
- Author(s)C. P. Wong,Daniel Lu,Yi Li
- PublisherSpringer-Verlag New York Inc.
- Date of Publication01/09/2009
- GenreElectronics Engineering & Communications Engineering
- Place of PublicationNew York, NY
- Country of PublicationUnited States
- ImprintSpringer-Verlag New York Inc.
- Content NoteXII, 437 p.
- Weight1780 g
- Width155 mm
- Height235 mm
- Edition Statement2010 ed.
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Thanks, we'll look into this.