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Wafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications by Yong Liu and Shichun Qu (2014, Hardcover)
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ISBN-13: 9781493915552, 978-1493915552. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years.
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About this product
Product Identifiers
PublisherSpringer New York
ISBN-10149391555X
ISBN-139781493915552
eBay Product ID (ePID)209511031
Product Key Features
Number of PagesXvii, 322 Pages
Publication NameWafer-Level Chip-Scale Packaging : Analog and Power Semiconductor Applications
LanguageEnglish
SubjectIndustrial Design / Packaging, Electronics / Circuits / General, Electronics / General, Mechanics / Thermodynamics
Publication Year2014
TypeTextbook
Subject AreaTechnology & Engineering, Science
AuthorYong Liu, Shichun Qu
FormatHardcover
Dimensions
Item Weight244.9 oz.
Item Length9.3 in
Item Width6.1 in
Additional Product Features
Intended AudienceScholarly & Professional
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