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Vertical 3D Memory Technologies by Betty Prince Wiley Book First Edition Tech
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Condition:
Like New
A book that has been read, but looks new. The book cover has no visible wear, and the dust jacket (if applicable) is included for hard covers. No missing or damaged pages, no creases or tears, no underlining or highlighting of text, and no writing in the margins. May have no identifying marks on the inside cover. No wear and tear. See the seller’s listing for full details and description of any imperfections.
- Buy it nowVertical 3D Memory Technologies by Betty Prince Wiley Book First Edition Tech
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Located in: Newark, California, United States
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eBay item number:257040260390
Item specifics
- Condition
- Pages
- 368
- Publication Date
- 2014-09-26
- ISBN
- 9781118760512
About this product
Product Identifiers
Publisher
Wiley & Sons, Incorporated, John
ISBN-10
1118760514
ISBN-13
9781118760512
eBay Product ID (ePID)
202810973
Product Key Features
Number of Pages
368 Pages
Language
English
Publication Name
Vertical 3d Memory Technologies
Publication Year
2014
Subject
Electronics / Semiconductors, Electronics / Circuits / Integrated
Type
Textbook
Subject Area
Technology & Engineering
Format
Hardcover
Dimensions
Item Height
0.9 in
Item Weight
25.3 Oz
Item Length
9.9 in
Item Width
7 in
Additional Product Features
Intended Audience
Scholarly & Professional
LCCN
2016-462932
Dewey Edition
23
Reviews
"In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies." ( 3dincites.com , 30 September 2014) "As the semiconductor memory industry moves to the third dimension a plethora of competing technologies has arisen each claiming to be the logical, lucrative successor to existing two dimensional versions. The very breadth of these new technologies can be confusing even to experienced industry professionals. Dr Prince's book appears at the right time to remove this confusion by explaining each technology's structure, function and potential advantages in a way that is accessible to both interested spectators and those working in the industry. It provides a welcome solid foundation to anyone interested in understanding the various technologies vying for success in this migration." --Andrew Walker, Schiltron Corporation, USA "This is a great review on the current state-of-the-art in the highly topical subject of vertical 3D memories. It comprises the challenges and current solutions of 3D memory integration with respective to different memory technologies. It is a highly valuable resource for researchers and engineers in the field of memory technology." -- Dr. Stephan Menzel, Forschungszentrum Jülich (PGI-7), Germany ".... one to consider if you want to bring yourself up to speed on recent research behind today's and tomorrow's 3D memory technologies. The book provides capsule summaries of over 360 papers and articles from scholarly journals organized into sections of related technologies to provide an invaluable reference on a particular 3D technology. It's a useful tool for locating research covering any of the numerous 3D technologies that are now finding their way into early production." -- Jim Handy, TheMemoryGuy.com, OBJECTIVE ANALYSIS Semiconductor Market Research, USA, "In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies." ( 3dincites.com , 30 September 2014) "As the semiconductor memory industry moves to the third dimension a plethora of competing technologies has arisen each claiming to be the logical, lucrative successor to existing two dimensional versions. The very breadth of these new technologies can be confusing even to experienced industry professionals. Dr Prince's book appears at the right time to remove this confusion by explaining each technology's structure, function and potential advantages in a way that is accessible to both interested spectators and those working in the industry. It provides a welcome solid foundation to anyone interested in understanding the various technologies vying for success in this migration." -- Andrew Walker, Schiltron Corporation, USA "This is a great review on the current state-of-the-art in the highly topical subject of vertical 3D memories. It comprises the challenges and current solutions of 3D memory integration with respective to different memory technologies. It is a highly valuable resource for researchers and engineers in the field of memory technology." -- Dr. Stephan Menzel, Forschungszentrum Jülich (PGI-7), Germany "... one to consider if you want to bring yourself up to speed on recent research behind today's and tomorrow's 3D memory technologies. The book provides capsule summaries of over 360 papers and articles from scholarly journals organized into sections of related technologies to provide an invaluable reference on a particular 3D technology. It's a useful tool for locating research covering any of the numerous 3D technologies that are now finding their way into early production." -- Jim Handy, TheMemoryGuy.com, OBJECTIVE ANALYSIS Semiconductor Market Research, USA
Illustrated
Yes
Dewey Decimal
621.39/732
Synopsis
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference, The large scale integration and planar scaling of individual system chips is reaching an expensive limit.
LC Classification Number
TK7874.893
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Seller Feedback (1,002)
- y***r (35)- Feedback left by buyer.Past 6 monthsVerified purchaseno complaints. the ds game came as described. wasn't destroyed in shipping unlike some other sellers. good seller. when the shipping company messed with the package, the seller was able to provide all the required details for me to get the package back. good communication.Kirby Squeak Squad (Nintendo DS, 2006) Complete CIB Authentic Game Manual Case (#267194156483)
- a***o (6)- Feedback left by buyer.Past 6 monthsVerified purchaseThe package arrived on time and exactly as described in the listing. It was well packaged and clean. The seller was very courteous and promptly addressed my inquiries via chat. Thank you very much.
- a***2 (115)- Feedback left by buyer.Past monthVerified purchaseA+ seller! Packing was great to protect during shipping and items were well described and the cost was very fair! Would purchase from this seller again!