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Sustainable Wireless Network-on-Chip Architectures by Jacob Murray 9780128036259

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Item specifics

Condition
New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
Imprint
Elsevier Science & Technology
Series
N/A
Publication Country
US
Country/Region of Manufacture
United States
Title
Sustainable Wireless Network-on-Chip Architectures
ISBN-10
N/A
Edition
N/A
Pagination
N/A
Width
154mm
Height
229mm
Depth
13mm
Weight
274g
Brand
Elsevier Science & Technology
Modified Item
No
Features
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Topic
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Era
N/A
Subjects
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Country
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Region
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City
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ISBN
9780128036259
EAN
9780128036259
Subject Area
Material Science
Publication Name
Sustainable Wireless Network-On-Chip Architectures
Publisher
Elsevier Science & Technology
Subject
Computer Science
Publication Year
2016
Type
Textbook
Format
Paperback
Language
English
Item Height
229mm
Author
Paul Wettin, Jacob Murray, Behrooz Shirazi, Partha Pratim Pande
Item Width
152mm
Item Weight
230g
Number of Pages
162 Pages

About this product

Product Information

Sustainable Wireless Network-on-Chip Architectures focuses on developing novel Dynamic Thermal Management (DTM) and Dynamic Voltage and Frequency Scaling (DVFS) algorithms that exploit the advantages inherent in WiNoC architectures. The methodologies proposed-combined with extensive experimental validation-collectively represent efforts to create a sustainable NoC architecture for future many-core chips. Current research trends show a necessary paradigm shift towards green and sustainable computing. As implementing massively parallel energy-efficient CPUs and reducing resource consumption become standard, and their speed and power continuously increase, energy issues become a significant concern. The need for promoting research in sustainable computing is imperative. As hundreds of cores are integrated in a single chip, designing effective packages for dissipating maximum heat is infeasible. Moreover, technology scaling is pushing the limits of affordable cooling, thereby requiring suitable design techniques to reduce peak temperatures. Addressing thermal concerns at different design stages is critical to the success of future generation systems. DTM and DVFS appear as solutions to avoid high spatial and temporal temperature variations among NoC components, and thereby mitigate local network hotspots.

Product Identifiers

Publisher
Elsevier Science & Technology
ISBN-13
9780128036259
eBay Product ID (ePID)
222025195

Product Key Features

Subject Area
Material Science
Author
Paul Wettin, Jacob Murray, Behrooz Shirazi, Partha Pratim Pande
Publication Name
Sustainable Wireless Network-On-Chip Architectures
Format
Paperback
Language
English
Subject
Computer Science
Publication Year
2016
Type
Textbook
Number of Pages
162 Pages

Dimensions

Item Height
229mm
Item Width
152mm
Item Weight
230g

Additional Product Features

Title_Author
Partha Pratim Pande, Jacob Murray, Behrooz Shirazi, Paul Wettin
Country/Region of Manufacture
United States

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  • CA 86820881RT0001
  • CH 442275272
  • GB 108277024
  • NZ 130504191
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