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Advanced Ta-Based Diffusion Barriers for Cu Interconnec - Paperback NEW Hubner,

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Last updated on 27 Apr, 2024 08:00:15 BSTView all revisionsView all revisions

Item specifics

Condition
New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
Weight
214grams
Subjects
Nonfiction, Technology & Engineering, Electronics,
Pages
102
Size
15.3 x 22.7 x 0.8 centimetres (0
Subject
Engineering
Book Title
Advanced Ta-Based Diffusion Barriers for Cu Interconnects. Ren H
Publication Date
10/09/2008
ISBN
9781604564518
Publication Year
2009
Type
Textbook
Format
Paperback
Subject Area
Material Science
Language
English
Publication Name
Advanced Ta-Based Diffusion Barriers for Cu Interconnects
Item Height
155mm
Author
Rene Hubner
Publisher
NOVA Science Publishers INC International Concepts
Item Width
230mm
Item Weight
184g
Number of Pages
102 Pages

About this product

Product Information

During the last few years, copper has become the standard metallisation material for on-chip interconnects in high-performance microprocessors. Compared to the previously used aluminium, copper shows not only a lower resistivity, but also significantly improved electromigration resistance. Copper ions, however, are very mobile in silicon and many dielectric materials under electrical and thermal bias. Thus, barrier layers are needed to prevent Cu diffusion into the insulating layers surrounding the metallic interconnects. Since Ta-based compounds are characterized by a high thermal stability, pure Ta films or layer stacks consisting of Ta and TaN are used for such barriers. The continuous scaling down of the interconnect dimensions and, therefore, the essential decrease in the barrier layer thickness coupled with the replacement of silicon oxide by advanced low-k dielectrics demand further improvements of the diffusion barrier performance. It is the aim of this book to carry out microstructure and functional property investigations for advanced, high-performance Tabased diffusion barriers (Ta-TaN layer stacks and Ta-Si-N single layers) before and after annealing to compare their thermal stabilities and to probe the corresponding failure mechanisms. For the Ta-TaN barriers, these studies are undertaken for a range of layer sequences, while for the Ta-Si-N barriers a variety of films with different chemical compositions are analysed.

Product Identifiers

Publisher
NOVA Science Publishers INC International Concepts
ISBN-13
9781604564518
eBay Product ID (ePID)
91858971

Product Key Features

Subject Area
Material Science
Author
Rene Hubner
Publication Name
Advanced Ta-Based Diffusion Barriers for Cu Interconnects
Format
Paperback
Language
English
Publication Year
2009
Type
Textbook
Number of Pages
102 Pages

Dimensions

Item Height
155mm
Item Width
230mm
Item Weight
184g

Additional Product Features

Title_Author
Rene Hubner
Country/Region of Manufacture
United States

Item description from the seller

Business seller information

Charlies Chapters Ltd
Charles Sword
81 Balmoral Drive
SOUTHPORT
Merseyside
PR9 8QH
United Kingdom
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:liamEku.oc.sretpahcseilrahc@skoobwontiyub
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Value added tax number:
  • GB 920245361
Company registration number:
  • 06386895
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  • 06386895
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The book arrived well packed get & I pristine condition at a good price. I would have liked it by 1st class post & I contacted this Seller via EBAY 'CONTACT' but got NO RESPONSE via either my email account or on ebay and certainly not in my Spam folder...SO what can you say I was inconvenienced a bit but got a positive outcome? I think they're reliable for transactions but something is remiss with electronic communication via EBAY or perhaps not tech savvy or disinterested or unwell etc..
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As usual with this seller, the book was exactly as described and very well packed. However, delivery times can vary significantly. This was one of 4 books ordered at the same time. Two arrived in about a week, but this one took almost 3 weeks. A reliable seller who answers questions promptly, but could improve on dispatch times.
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If you're happy to buy it now, receive it sometime in the future, this is the seller for you. Strangely nebulous and self destructive despatch times for a modern business, but, I've got my book, it was reasonably priced, packed okay and as described so a perfectly decent transaction. Happy enough customer, all fine.

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