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Failure Modes and Mechanisms in Electronic Packages by P. Singh, Puligandla Viswanadham (Paperback, 2012)
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ISBN-13: 9781461377634, 978-1461377634.
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About this product
Product Information
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.Product Identifiers
PublisherSpringer-Verlag New York Inc.
ISBN-139781461377634
eBay Product ID (ePID)149012023
Product Key Features
Number of Pages370 Pages
LanguageEnglish
Publication NameFailure Modes and Mechanisms in Electronic Packages
Publication Year2012
SubjectEngineering & Technology, Computer Science, Physics
TypeTextbook
AuthorP. Singh, Puligandla Viswanadham
Subject AreaElectrical Engineering
FormatPaperback
Dimensions
Item Height235 mm
Item Weight605 g
Item Width155 mm
Additional Product Features
Country/Region of ManufactureUnited States
Title_AuthorPuligandla Viswanadham, P. Singh
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