Failure Modes and Mechanisms in Electronic Packages by P. Singh, Puligandla Viswanadham (Paperback, 2012)

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Publisher: Springer ISBN 13: 9781461377634. New: New books are in mint condition, normally sourced directly from publishers. Used-like N : The book pretty much look like a new book. There will be no stains or markings on the book, the cover is clean and crisp, the book will look unread, the only marks there may be are slight bumping marks to the edges of the book where it may have been on a shelf previously.

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Product Information

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Product Identifiers

PublisherSpringer-Verlag New York Inc.
ISBN-139781461377634
eBay Product ID (ePID)149012023

Product Key Features

Number of Pages370 Pages
LanguageEnglish
Publication NameFailure Modes and Mechanisms in Electronic Packages
Publication Year2012
SubjectEngineering & Technology, Computer Science, Physics
TypeTextbook
AuthorP. Singh, Puligandla Viswanadham
Subject AreaElectrical Engineering
FormatPaperback

Dimensions

Item Height235 mm
Item Weight605 g
Item Width155 mm

Additional Product Features

Country/Region of ManufactureUnited States
Title_AuthorPuligandla Viswanadham, P. Singh

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