Failure Modes and Mechanisms in Electronic Packages by P. Singh, Puligandla Viswanadham (Paperback, 2012)

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Product Information

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Product Identifiers

PublisherSpringer-Verlag New York Inc.
ISBN-139781461377634
eBay Product ID (ePID)149012023

Product Key Features

Number of Pages370 Pages
LanguageEnglish
Publication NameFailure Modes and Mechanisms in Electronic Packages
Publication Year2012
SubjectEngineering & Technology, Computer Science, Physics
TypeTextbook
AuthorP. Singh, Puligandla Viswanadham
Subject AreaElectrical Engineering
FormatPaperback

Dimensions

Item Height235 mm
Item Weight605 g
Item Width155 mm

Additional Product Features

Country/Region of ManufactureUnited States
Title_AuthorPuligandla Viswanadham, P. Singh

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