Reliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing and Software Development by Taeho Taeho Kim, Wei-Ting Kary Wei-Ting Kary Chien and Way Way Kuo (2014, Trade Paperback)

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ISBN-13: 9781461375968, 978-1461375968. The international market is very competitive for high-tech manufacturers to?. Achieving competitive quality and reliability for products requires leader?. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics.

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Product Identifiers

PublisherSpringer
ISBN-101461375967
ISBN-139781461375968
eBay Product ID (ePID)209410315

Product Key Features

Number of PagesXxvi, 394 Pages
Publication NameReliability, Yield, and Stress Burn-In : A Unified Approach for Microelectronics Systems Manufacturing and Software Development
LanguageEnglish
Publication Year2014
SubjectSoftware Development & Engineering / General, Electronics / Semiconductors, Electronics / Circuits / Integrated, Electronics / Microelectronics, Manufacturing, Electrical, Materials Science / Electronic Materials
TypeTextbook
AuthorTaeho Taeho Kim, Wei-Ting Kary Wei-Ting Kary Chien, Way Way Kuo
Subject AreaComputers, Technology & Engineering
FormatTrade Paperback

Dimensions

Item Weight22.8 oz.
Item Length9.3 in
Item Width6.1 in

Additional Product Features

Intended AudienceScholarly & Professional

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