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About this product
Product Identifiers
PublisherSpringer Berlin / Heidelberg
ISBN-103662521350
ISBN-139783662521359
eBay Product ID (ePID)239640973
Product Key Features
Book TitlePhotonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Number of PagesXix, 325 Pages
LanguageEnglish
Publication Year2016
TopicLasers & Photonics, Industrial Design / Packaging, Nanotechnology & Mems, Telecommunications, Microwaves
IllustratorYes
GenreTechnology & Engineering
AuthorUlrich H. P. Fischer-Hirchert
FormatTrade Paperback
Dimensions
Item Weight25.3 Oz
Item Length9.3 in
Item Width6.1 in
Additional Product Features
Number of Volumes1 vol.
Table Of ContentIntroduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
SynopsisThis book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects., Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index., Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.
LC Classification NumberTK5101-5105.9
