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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng (Hardcover, 2018)
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Product Information
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching toolsProduct Identifiers
PublisherJohn Wiley & Sons AND Sons LTD
ISBN-139781119289647
eBay Product ID (ePID)3046589326
Product Key Features
Number of Pages464 Pages
Publication Name3d Ic and Rf Sips: Advanced Stacking and Planar Solutions for 5 g Mobility
LanguageEnglish
SubjectComputer Science, Physics
Publication Year2018
TypeTextbook
AuthorLih-Tyng Hwang, Tzyy-Sheng Jason Horng
SeriesWiley-Ieee
FormatHardcover
Dimensions
Item Height248 mm
Item Weight818 g
Item Width170 mm
Additional Product Features
Country/Region of ManufactureUnited States
Title_AuthorTzyy-Sheng Jason Horng, Lih-Tyng Hwang
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